1.Product description

This product SC98 is a transparent silicone elastomer, one component heat curing type, with thixotropic viscosity of adhesive sealing material. The product is mainly designed for the bonding seal of electronic components, cofferdam and FIPG field forming seal, suitable for automatic glue-coating, excellent technology, bright appearance, good adhesion to a variety of substrates, and can maintain long-term stability of mechanical properties and electrical insulation under a wide range of temperature, humidity and harsh environmental conditions.

2.Product advantages

l One -component, can be syringe coated or screen printed

l The colloid is fine and the surface is smooth and clean

l good adhesion, wide range of bonding

l Can be stored at room temperature, excellent extrusion performance

l Suitable for automatic gluing, no vertical flow, low trailing

3. Typical property

Apperance....................... . ......................................................... Translucent, transparent paste

Viscosity..................................................................................... Thixotropic/stationary

Curing conditions……………………………………………………. 30 min @ 150℃

Cured colloidal hardness, Shore A……………………………………… 32(Refer to ASTM D2240)

Tensile strength, Mpa …………………………………………………… 3.0

Thermal expansion coefficient 10-4/K………………………………… 2.9

Dielectric loss @1Mz……………………………………………… 0.040 (Refer to ASTM D149)

Dielectric constant @1MHz…………………………………………3.9(Refer to ASTM D150)

Volume resistivity ……………………………   1 x 1015 Ω forced the cm(Refer to ASTM D257)

Shelf life @ 25℃.............................................................................. 3 months

4.Notes

l The surface of the substrate shall be clean and dry, and moisture can be removed by heating. The surface of the substrate can be cleaned with naphtha, methyl ethyl ketone (MEK) or other suitable solvent. Solvents that dissolve or corrode the substrate should not be used. Solvents that remain should not be used

l Heat curing should use air exchangeable hot air oven. Trace amount of hydrogen may be generated during heating. Keep heating equipment ventilated to avoid accumulation.

l The curing speed of the product is related to the amount of glue applied and the heating problem of the single product. It is usually not recommended to bake and cure the product below 120℃.

l In most cases, polysiloxane is suitable for working at -45℃to 200℃for a long time, the highest short-term resistance to 350℃, specific use, it is best to test according to the requirements of the experiment.

l material before curing, can not contact N, P, S and other organic matter, can not contact Sn, Pb, Hg, Bi, As plasma compounds, can not contact acetylene active compounds, can not contact peroxide, water vapor, alcohol compounds. When these substances reach a certain concentration, they will hinder the solidification of the material, which is manifested in three phenomena: First, they have been in a fluid and unsolid state. Two, and the substrate surface contact thin layer in liquid or wire drawing state. Three, and the substrate surface has a tiny bubble.

Sufficient experiments should be done before use.

5. Storage and shelf life

1, Storage time: stored at 25℃for 3 months.

2. It is recommended to store it in cold storage at 0℃~5℃, and the shelf life is 9 months.

3. Unused products should be resealed for preservation.

6.packaging

7.Use restrictions

This product has not been tested and verified, and is only used for general industrial purposes. It does not use for direct contact with any medical, pharmaceutical or food purposes.